Advances in chemical mechanical planarization (CMP) / edited by Suryadevara Babu.
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
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| Online Access: |
Full Text (via Knovel) |
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| Other Authors: | |
| Format: | eBook |
| Language: | English |
| Published: |
Waltham, MA :
Woodhead Publishing,
[2016]
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| Series: | Woodhead Publishing series in electronic and optical materials ;
number 86. |
| Subjects: |
Internet
Full Text (via Knovel)Online
| Call Number: |
TK7874.84
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| TK7874.84 | Available |