Three-Dimensional Integration Technology for Advanced Focal Planes and Integrated Circuits

Three-Dimensional Integration Technology for Advanced Focal Planes and Integrated Circuits [electronic resource]

Show other versions (1)

Over the last five years MIT Lincoln Laboratory (MIT-LL) has developed a three-dimensional (3D) circuit integration technology that exploits the advantages of silicon-on-insulator (SOI) technology to enable wafer-level stacking and micrometer-scale electrical interconnection of fully fabricated circ...

Full description

Saved in:
Bibliographic Details
Online Access: Online Access
Corporate Author: Fermi National Accelerator Laboratory (Researcher)
Format: Government Document Electronic eBook
Language:English
Published: Washington, D.C. : Oak Ridge, Tenn. : United States. Department of Energy. Office of Science ; distributed by the Office of Scientific and Technical Information, U.S. Department of Energy, 2007.
Subjects:
Design.
Fabrication.
Integrated Circuits.
Optical Radar.
Photodiodes.
Processing.
General And Miscellaneous//Mathematics, Computing, And Information Science.

Internet

Online Access

Online

Holdings details from Online
Call Number: E 1.99:1016720
E 1.99:1016720 Available

Similar Items