Low density epoxy encapsulants

Low density epoxy encapsulants [electronic resource]

The resin, catalyst, and filler of an epoxy-hollow glass microsphere encapsulant were evaluated to solve problems associated with encapsulated electronic assemblies and an alternate source of hollow glass microspheres was selected. Specific problems related to the use of this encapsulant are discuss...

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Bibliographic Details
Online Access: Online Access
Main Author: Walker, J.M (Author)
Corporate Author: Bendix Corporation. Kansas City Division (Researcher)
Format: Government Document Electronic eBook
Language:English
Published: Oak Ridge, Tenn. : distributed by the Office of Scientific and Technical Information, U.S. Department of Energy, 1976.
Subjects:
Epoxides.
Fabrication.
Air.
Catalysts.
Density.
Dielectric Materials.
Electronic Equipment.
Foams.
Shrinkage.
Uses.
Viscosity.
Voids.
Colloids.
Dispersions.
Fluids.
Gases.
Organic Compounds.
Organic Oxygen Compounds.
Physical Properties.
Materials Science.

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Call Number: E 1.99:bdx-613-1411(rev.)
E 1.99:bdx-613-1411(rev.) Available

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