Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang.
I-Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II-Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III-Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV-Reliabili...
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| Online Access: |
Full Text (via Springer) |
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| Main Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer Science+Business Media, LLC,
1992.
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| Subjects: |
MARC
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| 050 | 4 | |a TK7868.P7 |b H83 1992eb | |
| 100 | 1 | |a Hwang, Jennie S. | |
| 245 | 1 | 0 | |a Solder paste in electronics packaging : |b technology and applications in surface mount, hybrid circuits, and component assembly / |c Jennie S. Hwang. |
| 260 | |a New York : |b Springer Science+Business Media, LLC, |c 1992. | ||
| 300 | |a 1 online resource (xxii, 456 pages) : |b illustrations. | ||
| 336 | |a text |b txt |2 rdacontent. | ||
| 337 | |a computer |b c |2 rdamedia. | ||
| 338 | |a online resource |b cr |2 rdacarrier. | ||
| 500 | |a Originally published by Van Nostrand Reinhold in 1992. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a pt. I. Overview -- pt. II. Basic technologies -- pt. III. Methodologies and applications -- pt. IV. Reliability, quality control, and tests -- pt. V. Appendix. | |
| 520 | |a I-Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II-Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III-Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV-Reliability, Quality Control, and Tests.- 9 Solder Joint Reliability and Inspection.- 10 Special Topics in Surface Mount Soldering Problems and Other Soldering-Related Problems.- 11 Quality Assurance and Tests.- V-Future Tasks and Emerging Trends.- 12 Future Developments.- VI-Appendix.- I. Federal Specificat. | ||
| 650 | 0 | |a Printed circuits |x Design and construction. | |
| 650 | 0 | |a Solder pastes. | |
| 650 | 0 | |a Surface mount technology. | |
| 650 | 7 | |a Printed circuits |x Design and construction. |2 fast |0 (OCoLC)fst01076543. | |
| 650 | 7 | |a Solder pastes. |2 fast |0 (OCoLC)fst01125229. | |
| 650 | 7 | |a Surface mount technology. |2 fast |0 (OCoLC)fst01139228. | |
| 776 | 0 | 8 | |i Print version: |a Hwang, Jennie S. |t Solder paste in electronics packaging. |d New York : Springer Science+Business Media, LLC, 1992 |w (DLC) 88028015. |
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