Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang.
I-Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II-Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III-Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV-Reliabili...
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Full Text (via Springer) |
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| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer Science+Business Media, LLC,
1992.
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Internet
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| Call Number: |
TK7868.P7 H83 1992eb
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| TK7868.P7 H83 1992eb | Available |