Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies

Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies [electronic resource]

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A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 ..mu..m to 762 ..mu..m diameter) an...

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Bibliographic Details
Online Access: Online Access
Format: Government Document Electronic eBook
Language:English
Published: Oak Ridge, Tenn. : distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1979.
Subjects:
Urethane.
Colloids.
Stress Relaxation.
Semimetals.
Rubbers.
Organic Compounds.
Polymers.
Electronic Equipment.
Joints.
Soldered Joints.
Organic Nitrogen Compounds.
Organic Oxygen Compounds.
Silicon.
Encapsulation.
Carbamates.
Carboxylic Acid Salts.
Organic Polymers.
Elements.
Elastomers.
Dispersions.
Epoxides.
Foams.
Sleeves.
Carbonic Acid Derivatives.
Materials Science.

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Call Number: E 1.99: conf-790506-4
E 1.99: conf-790506-4 Available

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