Studies on the disbonding initiation of interfacial cracks. [electronic resource]
With the continuing trend of decreasing feature sizes in flip-chip assemblies, the reliability tolerance to interfacial flaws is also decreasing. Small-scale disbonds will become more of a concern, pointing to the need for a better understanding of the initiation stage of interfacial delamination. W...
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Online Access |
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| Corporate Author: | |
| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Washington, D.C. : Oak Ridge, Tenn. :
United States. Department of Energy. ; distributed by the Office of Scientific and Technical Information, U.S. Department of Energy,
2005.
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| Subjects: |
Internet
Online AccessOnline
| Call Number: |
E 1.99:sand2005-4749
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| E 1.99:sand2005-4749 | Available |