Micro-machined heat pipes in silicon MCM substrates [electronic resource]
Multichip modules (MCMs) containing power components need a substrate with excellent heat spreading capability both to avoid hot spots and to move dissipated heat toward the system heat sinks. Polycrystalline diamond is an excellent MCM heat spreading substrate but remains several orders of magnitud...
Saved in:
| Online Access: |
Online Access |
|---|---|
| Corporate Author: | |
| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Washington, D.C. : Oak Ridge, Tenn. :
United States. Dept. of Energy ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy,
1995.
|
| Subjects: |
Internet
Online AccessOnline
| Call Number: |
E 1.99: conf-960250--1
|
|---|---|
| E 1.99: conf-960250--1 | Available |