Advanced packaging technology for high frequency photonic applications

Advanced packaging technology for high frequency photonic applications [electronic resource]

An advanced packaging concept has been developed for optical devices. This concept allows multiple fibers to be coupled to photonic integrated circuits, with no fiber penetration of the package walls. The principles used to accomplish this concept involves a second-order grating to couple light in o...

Full description

Saved in:
Bibliographic Details
Online Access: Online Access
Corporate Author: Sandia National Laboratories (Researcher)
Format: Government Document Electronic eBook
Language:English
Published: Washington, D.C. : Oak Ridge, Tenn. : United States. Dept. of Energy ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1996.
Subjects:
Design.
Laser Drilling.
Fabrication.
Fiber Optics.
Integrated Circuits.
Packaging.
Silicon.
Gratings.
Scanning Electron Microscopy.
Materials Science.
Engineering Not Included In Other Categories.

Internet

Online Access

Online

Holdings details from Online
Call Number: E 1.99:sand--96-0658
E 1.99:sand--96-0658 Available

Similar Items