Decomposed analysis of the reliability of area-array electronic packages including assembly process effects / by Terrace Barrell Thompson.

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Bibliographic Details
Main Author:	Thompson, Terrace Barrell
Format:	Thesis Book
Language:	English
Published:	2000.
Subjects:	Electronic packaging > Reliability. Electronic packaging > Mathematical models. Solder and soldering > Testing. Theses > CU Boulder > Mechanical Engineering.

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Holdings details from PASCAL Offsite
Call Number:	T 2000 .T378
T 2000 .T378	Available Place a Hold