RF modeling of flip-chip interconnects and MEMS in microwave/MM-wave circuits /

RF modeling of flip-chip interconnects and MEMS in microwave/MM-wave circuits / by Zhiping Feng.

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Bibliographic Details
Main Author: Feng, Zhiping
Format: Thesis Book
Language:English
Published: 2000.
Subjects:
Microwave circuits > Design and construction.
Multichip modules (Microelectronics)
Microelectromechanical systems.
Theses > CU Boulder > Electrical Engineering.
Description
Physical Description:xxv, 202 leaves : illustrations ; 28 cm.
Bibliography:Includes bibliographical references (leaves [195]-202)

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