RF modeling of flip-chip interconnects and MEMS in microwave/MM-wave circuits /

RF modeling of flip-chip interconnects and MEMS in microwave/MM-wave circuits / by Zhiping Feng.

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Bibliographic Details
Main Author: Feng, Zhiping
Format: Thesis Book
Language:English
Published: 2000.
Subjects:
Microwave circuits > Design and construction.
Multichip modules (Microelectronics)
Microelectromechanical systems.
Theses > CU Boulder > Electrical Engineering.

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Holdings details from PASCAL Offsite
Call Number: T 2000 .F356
T 2000 .F356 Available Place a Hold

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