Chip scale package (CSP) : design, materials, processes, reliability, and applications /

Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

Saved in:
Bibliographic Details
Main Author: Lau, John H.
Other Authors: Lee, Shi-Wei Ricky
Format: Book
Language:English
Published: New York : McGraw-Hill, ©1999.
Series:Electronic packaging and interconnection series.
Subjects:
Integrated circuits > Design and construction.
Microelectronic packaging.
Description
Physical Description:xxii, 564 pages : illustrations ; 24 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0070383049

Similar Items