Chip scale package (CSP) : design, materials, processes, reliability, and applications /

Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

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Bibliographic Details
Main Author: Lau, John H.
Other Authors: Lee, Shi-Wei Ricky
Format: Book
Language:English
Published: New York : McGraw-Hill, ©1999.
Series:Electronic packaging and interconnection series.
Subjects:
Integrated circuits > Design and construction.
Microelectronic packaging.

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Holdings details from PASCAL Offsite
Call Number: TK7874 .L3167 1999
TK7874 .L3167 1999 Available Place a Hold

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