Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.

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Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Manufacturing Engineering Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
Other Authors:	Ume, Charles, Chao, Pin-Yeh
Format:	Conference Proceeding Book
Language:	English
Published:	New York : American Society of Mechanical Engineers, ©1995.
Series:	MED (Series) ; vol. 3. EEP (Series) ; vol. 14.
Subjects:	Electronic packaging > Equipment and supplies > Congresses. Detectors > Industrial applications > Congresses.

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Call Number:	TK7870.15 S46 1995
TK7870.15 S46 1995	Checked out – Due: 04-12-2027