Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.
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Corporate Authors: | , , |
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Other Authors: | , |
Format: | Conference Proceeding Book |
Language: | English |
Published: |
New York :
American Society of Mechanical Engineers,
©1995.
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Series: | MED (Series) ;
vol. 3. EEP (Series) ; vol. 14. |
Subjects: |
En Route to PASCAL
Call Number: |
TK7870.15 S46 1995
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TK7870.15 S46 1995 | Checked out – Due: 04-12-2027 |