Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu [and others]
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| Corporate Authors: | , , |
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| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
New York :
American Society of Mechanical Engineers,
©1995.
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| Series: | EEP (Series) ;
vol. 11. MD (Series) ; v. 64. |
| Subjects: |
Closed Stacks - Engineering Math & Physics Library - Stacks
| Call Number: |
TK7870.15 .I593 1995
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| TK7870.15 .I593 1995 | Available Place a Hold |