Heat transfer in electronic systems, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / sponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz [and others]

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Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Heat Transfer Division, International Mechanical Engineering Congress and Exposition
Other Authors:	Wirtz, R. A.
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, ©1994.
Series:	HTD (Series) ; vol. 292.
Subjects:	Electronic apparatus and appliances > Cooling > Congresses. Heat > Transmission > Congresses. Electronic packaging > Congresses.

Closed Stacks - Engineering Math & Physics Library - Stacks

Holdings details from Closed Stacks - Engineering Math & Physics Library - Stacks
Call Number:	TK7870.25 .H43 1994
TK7870.25 .H43 1994	Checked out – Due: 04-12-2027 Place a Hold