Materials and process characterization for VLSI, 1988 (ICMPC '88) : proceedings of the international conference : Oct. 24-29, 1988, Shanghai, China /

Materials and process characterization for VLSI, 1988 (ICMPC '88) : proceedings of the international conference : Oct. 24-29, 1988, Shanghai, China / editors, X.-F. Zong, Y.-Y. Wang, J. Chen.

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Bibliographic Details
Corporate Author: International Conference on Materials and Process Characterization for VLSI
Other Authors: Zong, X.-F. (Xiangfu), Wang, Y.-Y. (Yangyuan), Chen, J. (Jun)
Format: Conference Proceeding Book
Language:English
Published: Singapore ; Teaneck, N.J. : World Scientific, ©1988.
Subjects:
Integrated circuits > Very large scale integration > Congresses.

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Holdings details from PASCAL Offsite
Call Number: TK7874 .M34 1988
TK7874 .M34 1988 Available Place a Hold

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