Thermal and Mechanical Design of a High-Voltage Power Electronics Package [electronic resource] : Preprint.
Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that p...
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| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Golden, Colo. : Oak Ridge, Tenn. :
National Renewable Energy Laboratory (U.S.) ; Distributed by the Office of Scientific and Technical Information, U.S. Department of Energy,
2021.
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| Call Number: |
E 1.99:nrel/cp-5400-79398
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| E 1.99:nrel/cp-5400-79398 | Available |