Assembly and reliability of lead-free solder joints [electronic resource] / John H. Lau, Ning-Cheng Lee.

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Bibliographic Details
Online Access:	Full Text (via Springer)
Main Author:	Lau, John H.
Other Authors:	Lee, Ning-Cheng
Format:	Electronic eBook
Language:	English
Published:	Singapore : Springer, 2020.
Subjects:	Solder and soldering. Joints (Engineering)

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Full Text (via Springer)

Holdings details from Online
Call Number:	TS610
TS610	Available