Showing 1 - 20 results of 25 for search 'Lau, John H.', query time: 0.09s Refine Results
  1. 1
    Microvias : for low cost, high density interconnects /

    Microvias : for low cost, high density interconnects / by Lau, John H.

    Published 2001
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  2. 2
    Chip scale package (CSP) : design, materials, processes, reliability, and applications /

    Chip scale package (CSP) : design, materials, processes, reliability, and applications / by Lau, John H.

    Published 1999
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  3. 3
    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /

    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / by Lau, John H.

    Published 2000
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  4. 4
    Flip chip, hybrid bonding, fan-in, and fan-out technology

    Flip chip, hybrid bonding, fan-in, and fan-out technology by Lau, John H.

    Published 2024
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  5. 5
    Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /

    Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / by Lau, John H.

    Published 1997
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  6. 6
    Microvias for low cost, high density interconnects /

    Microvias for low cost, high density interconnects / by Lau, John H.

    Published 2001
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  7. 7
    Reliability of RoHS-Compliant 2D and 3D IC interconnects

    Reliability of RoHS-Compliant 2D and 3D IC interconnects by Lau, John H.

    Published 2011
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  8. 8
    3D IC integration and packaging /

    3D IC integration and packaging / by Lau, John H.

    Published 2016
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  9. 9
    Through-silicon Vias for 3D Integration /

    Through-silicon Vias for 3D Integration / by Lau, John H.

    Published 2013
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  10. 10
    Semiconductor advanced packaging /

    Semiconductor advanced packaging / by Lau, John H.

    Published 2021
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  11. 11
    Fan-out wafer-level packaging /

    Fan-out wafer-level packaging / by Lau, John H.

    Published 2018
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  12. 12
    Heterogeneous integrations /

    Heterogeneous integrations / by Lau, John H.

    Published 2019
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  13. 13
    Chiplet design and heterogeneous integration packaging /

    Chiplet design and heterogeneous integration packaging / by Lau, John H.

    Published 2023
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  14. 14
    Assembly and reliability of lead-free solder joints

    Assembly and reliability of lead-free solder joints by Lau, John H.

    Published 2020
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  15. 15
    Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /

    Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /

    Published 2003
    Other Authors: “…Lau, John H.…”
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  16. 16
    Handbook of fine pitch surface mount technology /

    Handbook of fine pitch surface mount technology /

    Published 1994
    Other Authors: “…Lau, John H.…”
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  17. 17
    Handbook of tape automated bonding /

    Handbook of tape automated bonding /

    Published 1992
    Other Authors: “…Lau, John H.…”
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  18. 18
    Chip on board technologies for multichip modules /

    Chip on board technologies for multichip modules /

    Published 1994
    Other Authors: “…Lau, John H.…”
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  19. 19
    Ball grid array technology /

    Ball grid array technology /

    Published 1995
    Other Authors: “…Lau, John H.…”
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  20. 20
    Flip chip technologies /

    Flip chip technologies /

    Published 1996
    Other Authors: “…Lau, John H.…”
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