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  1. 1
    Fixed film dielectric capacitors in metallic and non-metallic cases for D.C. application /

    Fixed film dielectric capacitors in metallic and non-metallic cases for D.C. application /

    Published 1970
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  2. 2
    Hermeticity of electronic packages

    Hermeticity of electronic packages by Greenhouse, Hal

    Published 2012
    Full Text (via ScienceDirect)
    Electronic eBook
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  3. 3
    Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /

    Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. /

    Published 1997
    Full Text (via Internet Archive)
    Conference Proceeding eBook
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  4. 4
    Parts list supplement to RS-376, "Fixed film dielectric capacitors in metallic and non-metallic cases for D.C. application" /

    Parts list supplement to RS-376, "Fixed film dielectric capacitors in metallic and non-metallic cases for D.C. application" /

    Published 1972
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  5. 5
    Metallized dielectric capacitors in metallic and non-metallic cases for direct current application /

    Metallized dielectric capacitors in metallic and non-metallic cases for direct current application /

    Published 1971
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  6. 6
    Parts list supplement to RS-377, "Metallized dielectric capacitors in metallic and non-metallic cases for direct current application" /

    Parts list supplement to RS-377, "Metallized dielectric capacitors in metallic and non-metallic cases for direct current application" /

    Published 1973
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  7. 7
    Nano-bio-electronic, photonic and MEMS packaging /

    Nano-bio-electronic, photonic and MEMS packaging /

    Published 2021
    Full Text (via Springer)
    Electronic eBook
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  8. 8
    Workshop on: Interconnects and packaging for RF wireless communication systems /

    Workshop on: Interconnects and packaging for RF wireless communication systems /

    Published 1997
    Conference Proceeding Book
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  9. 9
    Thermal management materials for electronic packaging : preparation, characterization, and devices /

    Thermal management materials for electronic packaging : preparation, characterization, and devices /

    Published 2024
    Full Text (via Wiley)
    Electronic eBook
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  10. 10
    Run-to-run control in semiconductor manufacturing /

    Run-to-run control in semiconductor manufacturing /

    Published 2001
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  11. 11
    Study of self-aligning soldering for electronic/optoelectronic packaging /

    Study of self-aligning soldering for electronic/optoelectronic packaging / by Patra, Susant Kumar

    Published 1992
    Thesis Book
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  12. 12
    Multichip modules : systems advantages, major constructions, and materials technologies /

    Multichip modules : systems advantages, major constructions, and materials technologies /

    Published 1991
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  13. 13
    GaAs die crack initiation in area array electronic packages /

    GaAs die crack initiation in area array electronic packages / by Su, Bingzhi

    Published 2000
    Thesis Book
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  14. 14
    Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /

    Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /

    Published 2000
    Conference Proceeding Book
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  15. 15
    Thermal performance and reliability of bonded interfaces for power electronics packaging applications /

    Thermal performance and reliability of bonded interfaces for power electronics packaging applications / by DeVoto, Douglas

    Published 2011
    Online Access
    Government Document eBook
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  16. 16
    Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. /

    Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. /

    Published 2005
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  17. 17
    Decomposed analysis of the reliability of area-array electronic packages including assembly process effects /

    Decomposed analysis of the reliability of area-array electronic packages including assembly process effects / by Thompson, Terrace Barrell

    Published 2000
    Thesis Book
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  18. 18
    Failure modes and mechanisms in electronic packages /

    Failure modes and mechanisms in electronic packages / by Viswanadham, Puligandla

    Published 1998
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  19. 19
    Boundary-scan interconnect diagnosis /

    Boundary-scan interconnect diagnosis / by Sousa, José T. de

    Published 2001
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  20. 20
    Sectional design standard for organic multichip modules (MCM-L) and MCM-L assemblies /

    Sectional design standard for organic multichip modules (MCM-L) and MCM-L assemblies /

    Published 1998
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