Showing 1 - 20 results of 89 for search 'Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)', query time: 0.07s Refine Results
  1. 1
    Sectional design standard for organic multichip modules (MCM-L) and MCM-L assemblies /

    Sectional design standard for organic multichip modules (MCM-L) and MCM-L assemblies /

    Published 1998
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  2. 2
    Acceptability of electronic assemblies.

    Acceptability of electronic assemblies.

    Published 1994
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  3. 3
    Electronic design data description for printed boards /

    Electronic design data description for printed boards /

    Published 1985
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  4. 4
    Documentation requirements for printed boards, assemblies and support drawings /

    Documentation requirements for printed boards, assemblies and support drawings /

    Published 1995
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  5. 5
    Solderability tests for component leads, terminations, lugs, terminals and wires.

    Solderability tests for component leads, terminations, lugs, terminals and wires.

    Published 1998
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  6. 6
    General specification for 1/8 inch diameter shank carbide drills for printed boards /

    General specification for 1/8 inch diameter shank carbide drills for printed boards /

    Published 1979
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  7. 7
    Post solder solvent cleaning handbook : a standard /

    Post solder solvent cleaning handbook : a standard /

    Published 1987
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  8. 8
    Microwave end product board inspection and test : a standard /

    Microwave end product board inspection and test : a standard /

    Published 1985
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  9. 9
    Bare board electrical test information in digital form : a standard /

    Bare board electrical test information in digital form : a standard /

    Published 1992
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  10. 10
    Specification for rigid substrates for additive process printed boards /

    Specification for rigid substrates for additive process printed boards /

    Published 1982
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  11. 11
    Design guide for press fit rigid printed board backplanes /

    Design guide for press fit rigid printed board backplanes /

    Published 1982
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  12. 12
    Thin copper foil for printed wiring applications /

    Thin copper foil for printed wiring applications /

    Published 1979
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  13. 13
    Printed board component mounting /

    Printed board component mounting /

    Published 1987
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  14. 14
    Design standard for rigid printed boards and rigid printed board assemblies /

    Design standard for rigid printed boards and rigid printed board assemblies /

    Published 1991
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  15. 15
    Printed board dimensions and tolerances : a standard /

    Printed board dimensions and tolerances : a standard /

    Published 1984
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  16. 16
    Guidelines for artwork generation and measurement techniques.

    Guidelines for artwork generation and measurement techniques.

    Published 1977
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  17. 17
    Guidelines for phototool generation and measurement techniques : interim final /

    Guidelines for phototool generation and measurement techniques : interim final /

    Published 1991
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  18. 18
    Drilling guidelines for printed boards.

    Drilling guidelines for printed boards.

    Published 1988
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  19. 19
    Acceptability of printed boards : a standard /

    Acceptability of printed boards : a standard /

    Published 1995
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
  20. 20
    Design standard for thick film multilayer hybrid circuits /

    Design standard for thick film multilayer hybrid circuits /

    Published 1989
    “…Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)…”
    Book
    Save to List
    Saved in:
Search Tools: RSS Feed – Save Search