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Handbook of 3D Integration Volume 4: Design, Test, and Thermal Management. by Franzon, Paul D.
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Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia /
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Verilog styles for synthesis of digital systems / by Smith, David Richard
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Design, characterization, and packaging for MEMS and microelectronics II 17-19 December, 2001, Adelaide, Australia /
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Multichip module technologies and alternatives : the basics /
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High performance design automation for multi-chip modules and packages /
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Multichip module technologies and alternatives : the basics /
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Handbook of 3D integration.
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Handbook of 3D integration.
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Related Subjects
Design and construction
Microelectronic packaging
Computer-aided design
Integrated circuits
Microelectromechanical systems
Three-dimensional imaging
Three-dimensional integrated circuits
Very large scale integration
Data processing
Design
Electronic packaging
Field programmable gate arrays
Multichip modules (Microelectronics)
Verilog (Computer hardware description language)