-
1
Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
Published 1993“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Book
-
2
Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
Published 1996“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
3
CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
Published 1994“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
4
CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas,...
Published 1997“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
5
Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : Novemb...
Published 1998“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
6
Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996,...
Published 1996“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
7
Computer aided design in electronic packaging /
Published 1992“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Book -
8
Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida /
Published 2000“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
9
Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, T...
Published 1997“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
10
Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
Published 1995“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
11
Structural analysis in microelectronics and fiber optics : presented at the ... ASME Winter Annual Meeting /
Published 1993“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding -
12
Applications of experimental mechanics to electronic packaging.
“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Request a PDF (UCB only)
Conference Proceeding -
13
Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Geo...
Published 1991“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Book -
14
Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1...
Published 1995“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
15
Manufacturing aspects in electronic packaging.
Published 1992“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Request a PDF (UCB only)
Serial -
16
Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Cal...
Published 1995“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
17
Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices : presented at Hotel Concorde Saint-Lazare, November 29-Decembe...
Published 1998“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book -
18
Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications : Mechanics, Physics, Reliability, Processing : presented at Hotel Concorde...
Published 1999“…American Society of Mechanical Engineers. Electrical and Electronic Packaging Division…”
Conference Proceeding Book
