Technologies for highly parallel optoelectronic integrated circuits [electronic resource]
While summarily reviewing the range of optoelectronic integrated circuits (OEICs), this paper emphasizes technology for highly parallel optical interconnections. Market volume and integration suitability considerations highlight board-to-board interconnects within systems as an initial insertion poi...
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Online Access |
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| Corporate Author: | |
| Format: | Government Document Electronic eBook |
| Language: | English |
| Published: |
Washington, D.C. : Oak Ridge, Tenn. :
United States. Dept. of Energy ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy,
1994.
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| Subjects: |
| Summary: | While summarily reviewing the range of optoelectronic integrated circuits (OEICs), this paper emphasizes technology for highly parallel optical interconnections. Market volume and integration suitability considerations highlight board-to-board interconnects within systems as an initial insertion point for large OEIC production. The large channel count of these intrasystem interconnects necessitates two-dimensional laser transmitter and photoreceiver arrays. Surface normal optoelectronic components are promoted as a basis for OEICs in this application. An example system is discussed that uses vertical cavity surface emitting lasers for optical buses between layers of stacked multichip modules. Another potentially important application for highly parallel OEICs is optical routing or packet switching, and examples of such systems based on smart pixels are presented. |
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| Item Description: | Published through the Information Bridge: DOE Scientific and Technical Information. 10/01/1994. "sand--94-2349c" " conf-9410195--2" "DE95001607" "GB0103012" GaAs symposium,Philadelphia, PA (United States),16-19 Oct 1994. Lear, K.L. |
| Physical Description: | 6 p. : digital, PDF file. |