Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC)

Saved in:

Bibliographic Details
Corporate Authors:	Society of Automotive Engineers, SAE World Congress
Format:	Conference Proceeding Book
Language:	English
Published:	Warrendale, PA : Society of Automotive Engineers, ©2004.
Series:	SP (Society of Automotive Engineers) ; SP-1857.
Subjects:	Automobiles > Electronic equipment > Congresses. Automobiles > Electric equipment > Congresses. Electronic packaging > Congresses. Electromagnetic compatibility > Congresses.

PASCAL Offsite

Holdings details from PASCAL Offsite
Call Number:	TL272.5 .S69 2004
TL272.5 .S69 2004	Available Place a Hold