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021106s2003 gw a b 001 0 eng |
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|a 2002042618
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|a 3540001115 (alk. paper)
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|a 7302059039 (Tsinghua University Press)
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|a (OCoLC)ocm51022633
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|a DLC
|c DLC
|d YDX
|d OHX
|d OCLCQ
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|a pcc
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|a CODI
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|a TK7872.T55
|b F86 2003
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050 |
0 |
0 |
|a TK7872.T55
|b F86 2003
|
072 |
|
7 |
|a TA
|2 lcco
|
245 |
0 |
0 |
|a Functional thin films and functional materials :
|b new concepts and technologies /
|c Donglu Shi (ed.)
|
260 |
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|a Berlin ;
|a New York :
|b Springer :
|b Tsinghua University Press,
|c ©2003.
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300 |
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|a xiii, 443 pages :
|b illustrations ;
|c 25 cm.
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336 |
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|a text
|b txt
|2 rdacontent.
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337 |
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|a unmediated
|b n
|2 rdamedia.
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338 |
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|a volume
|b nc
|2 rdacarrier.
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490 |
1 |
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|a Springer series in materials science ;
|v 58.
|
504 |
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|a Includes bibliographical references and index.
|
650 |
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|a Thin film devices.
|0 http://id.loc.gov/authorities/subjects/sh85134863.
|
700 |
1 |
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|a Shi, Donglu.
|0 http://id.loc.gov/authorities/names/n94065184
|1 http://isni.org/isni/0000000116396159.
|
830 |
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0 |
|a Springer series in materials science ;
|v v. 58.
|0 http://id.loc.gov/authorities/names/n86740676.
|
907 |
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|a .b36115319
|b 04-25-23
|c 02-25-04
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|a eng
|b 05-24-04
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|a .b36115319
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|a MARS - RDA ENRICHED
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907 |
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|a .b36115319
|b 12-29-08
|c 02-25-04
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907 |
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|p Can circulate
|a University of Colorado Boulder
|b Boulder Campus
|c Engineering Math & Physics
|d Engineering Math & Physics Library - Stacks
|e TK7872.T55 F86 2003
|h Library of Congress classification
|i book
|m U183044260935
|n 2
|
952 |
f |
f |
|p Can circulate
|a University of Colorado Boulder
|b Boulder Campus
|c Engineering Math & Physics
|d Engineering Math & Physics Library - Stacks
|e TK7872.T55 F86 2003
|h Library of Congress classification
|i book
|m U183074930586
|n 1
|