Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /

Cooling and thermal design of electronic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon [and others]

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Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition San Francisco, Calif., American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Other Authors: Amon, Cristina H.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, ©1995.
Series:HTD (Series) ; vol. 319.
EEP (Series) ; vol. 15.
Subjects:
Electronic systems > Cooling > Congresses.
Electronic systems > Thermal properties > Congresses.
Electronic apparatus and appliances > Cooling > Congresses.
Electronic apparatus and appliances > Thermal properties > Congresses.

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Call Number: TK7870.25 .I56 1995
TK7870.25 .I56 1995 Checked out – Due: 04-12-2027

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