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From LED to solid state lighting : principles, materials, packaging, characterization, and applications / by Lee, Shi-Wei Ricky, Lo, Jeffery C. C., Tao, Mian, Ye, Huaiyu
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Chip scale package (CSP) : design, materials, processes, reliability, and applications / by Lau, John H.
Published 1999Other Authors: “…Lee, Shi-Wei Ricky…”
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