| Call Number (LC) | Title | Results |
|---|---|---|
| TK7874 .L3 1983 |
Laser processing of semiconductor devices : January 18-19, 1983, Los Angeles, California / Laser processing of semiconductor devices January 18-19, 1983, Los Angeles, California / |
2 |
| TK7874 .L315 1986 |
Laser processing of semiconductors and hybrids : 21-22 January 1986, Los Angeles, California / Laser processing of semiconductors and hybrids 21-22 January 1986, Los Angeles, California / |
2 |
| TK7874 .L316 1987 | Lasers in microlithography : 2-3 March 1987, Santa Clara, California / | 1 |
| TK7874 .L316 1991 | Lasers in microelectronic manufacturing 10-11 September 1991, San Jose, California / | 1 |
| TK7874 .L3167 1999 | Chip scale package (CSP) : design, materials, processes, reliability, and applications / | 1 |
| TK7874 .L3168 2000 | Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / | 1 |
| TK7874 .L31684 2001 | Microvias : for low cost, high density interconnects / | 1 |
| TK7874 .L31684 2001eb | Microvias for low cost, high density interconnects / | 1 |
| TK7874 .L317 1997 | Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / | 1 |
| TK7874 .L32 1994 | Design of analog integrated circuits and systems / | 1 |
| TK7874 .L334 1993 | Hot-carrier reliability of MOS VLSI circuits / | 1 |
| TK7874 .L34 1990 | Fundamentals of microelectronics processing / | 1 |
| TK7874 .L344 1998 | Piecewise linear modeling and analysis / | 1 |
| TK7874 .L38 |
Manual for integrated circuit users / Manual for integrated circuit users |
2 |
| TK7874 .L397 2001 | Principles of lithography / | 1 |
| TK7874 .L397 2005 | Principles of lithography / | 1 |
| TK7874 .L397 2005e | Principles of lithography | 1 |
| TK7874 .L397 2010 | Principles of lithography | 1 |
| TK7874 .L437 2017 | SiP-System in Package Design and Simulation : Mentor EE Flow Advanced Design Guide. | 1 |
| TK7874 .L45 1998 | Hybrid microcircuit technology handbook : materials, processes, design, testing, and production / | 1 |
